The first monolithic integrated triaxial accelerometer

The monolithic integration of standard CMOS processes and MEMS sensors, combined with the latest technology in wafer-level packaging processes, makes the 3D accelerometers the smallest size and lowest price in the world of employment a unit price of only $0.19.

Wuxi, China, August 15, 2014 /PRNewswire/ -- MENZ Semiconductor, the world's leading supplier of MEMS sensor and sensing system solutions, today announced the launch of the MXC400xXC, the world's first single-chip integrated signal processing and MEMS sensor The three-axis (3D) accelerometer is also the world's first 3D accelerometer using a wafer-level packaging process. The integration of 3D integrated sensors and wafer-level packaging represents the most advanced technology in the industry today, reducing costs by nearly 60%, reducing sensor area by 50%, and leading new mobile and consumer device applications including mobile phones and tablets Computers, toys, and wearable devices.

The technical breakthrough of this new 3D accelerometer comes from the unique global patented product: thermal accelerometer. The MEMS sensor structure is directly etched into standard CMOS wafers and is the only standard CMOS monolithic integration solution in the world. This technology uses a thermal convection of the heated gas molecules in the closed chamber to sense acceleration or tilt. In the vehicle stability control and rollover detection, digital cameras, projectors and many other fields, the new product line has been successfully used for many years. Now, the new R&D team of the United States has pushed this technology to a completely new level. While keeping the small size and low cost, it has integrated the latest technologies such as mixed signal processing, 3D MEMS sensing, and wafer-level packaging on the standard CMOS process.

The MXC400xXC offers more performance for size and price-sensitive mobile and consumer electronics device manufacturers. In addition to the world's lowest unit price, the MXC400xXC also offers 12-bit precision, ±2g/±4g/±8g of adjustable measurement range, 8-bit temperature output and orientation/dithering sensing. Compared to the industry standard 2mmx2mm solution, the MXC400xXC has a package size of only 1.2mmx1.7mm. Like all new thermal accelerometers, there are no moving parts in the MXC400xXCMEMS sensor, ensuring that the sensor structure has exceptional stability against shock and vibration (withstands shocks greater than 200,000 g without changes in sensing performance). This is crucial for the reliability of many wearable devices and consumer electronics applications.

Dr. Zhao Yang, founder and CEO of MIX Semiconductor, said: “Mexin has provided thermal accelerometers to the market for more than a decade. The MXC400xXC's sensor design, signal processing architecture and MEMS wafer-level packaging are all revolutionary. The technological breakthrough marks the unprecedented size and price of new MEMS devices from the United States. This will promote the rapid development of the global consumer, mobile and wearable devices market."

Price and delivery The new MXC400xXC three-axis accelerometer is priced at US$0.19 per unit, and is sampling now.