China's status as a major manufacturing country is no doubt, but the prosperity of the manufacturing industry is only the first step in the development of the IC industry. The low-value-added low-end manufacturing industry is obviously not a long-term solution. To realize the sound development of the industry, we must attach importance to “creating in China” and IC design is undoubtedly the core part of it. The IC industry is a national strategic industry and its importance is self-evident. IC design and chip manufacturing complement each other. Their integration and linking are important driving forces for the entire industry, and they are also the core elements of building a strategic emerging industry value chain.

On March 17, the “Seminar on China IC Design and Manufacturing Localization” held in Shanghai in the same period as SEMICONChina 2011 was successfully held in Shanghai. This seminar invited international and domestic advanced manufacturers, such as SMIC, TSMC, Grace, HuaHongNEC, ASMC, and well-known IC design companies such as Verisilicon, Marvell, and Open-Silicon.

The status of China's local chip manufacturing industry The chip manufacturing industry belongs to high-end manufacturing. Technology content, cost investment, and strategic importance are not to be underestimated. After years of hard work, China's local chip manufacturing industry has made considerable progress. Leading foundries have their own unique craftsmanship.

"Shanghai Advanced Semiconductor was founded in 1988, has a long history of foundry, and has a complete range of technological product lines. At the same time, ASMC is also the first domestic semiconductor manufacturing company engaged in the manufacture of automotive electronic chips. It began production for automotive safety in 1995. The electronic chip of the airbag has accumulated rich experience in the process management of automotive electronic chip manufacturing.” Akai Chief Technical Officer Shao Kai said, “Our process platform includes analog devices, power devices and sensors. In MEMS, ASMC’s MEMS The process includes front and back roads, the former road purification workshop is 4,300 square meters, and the latter road purification workshop is 300 square meters.The MEMS front-end process capability includes double-side photolithography, DRIE, wet process (TMAH), HT furnace tubes and IC foundry. Standard process capability; back process capabilities include double-sided photolithography, DRIE, wet process, metal sputtering, Bonding, Grinder, etc. The MEMs are available in a wide variety of products."

Power semiconductor devices can greatly increase the energy conversion efficiency while making it possible to use new energy sources (such as hydropower, wind power, battery chemical energy, etc.). The realization of the goal of energy-saving emission reduction in China depends on the development of power semiconductors.

"Power semiconductors are nuclear cores for energy conservation and emission reduction. China's power management IC market is expected to reach $4.7 billion in 2012, and energy conservation and emission reduction will create a huge power semiconductor market." Shanghai Hua Hong NEC Electronics Co., Ltd. Sales and Marketing Vice According to President Gao Feng, “The recently developed 0.18um BCD and 0.13um CDMOS (with high reliability memory) of Hua Hong NEC have provided customers with new options and are ideally suited for digital power supplies, LED drivers, battery protection and power management applications. Hong NEC will provide a wide range of advanced cost-effective solutions ranging from 1 um to 0.13 um, a wide range of advanced cost-effective solutions from 5 V to 700 V, as well as stable process capability and rich options to serve customers, closely cooperate with customers, and reduce Product development cycle, reducing development costs."

Gao Feng also said that as the world's first 8-inch foundry to provide MOSFET business, Hua Hong NEC has provided strong support for customers with stable high qualification rate, abundant production capacity and reliable performance, and has grown up with customers as the industry's Mainstream MOSFET supplier; Hua Hong NEC has accumulated rich experience in volume production for more than 8 years and 2 million 8-inch wafers (more than 20 billion chips). Through years of mass production, we have also cultivated an efficient and reliable team, accumulated many know-how, and greatly reduced the development time of new products for customers. In the future, Hua Hong NEC will continue to provide high-power and high-current power discrete devices. Going forward, we provide a series of super junction products, high-voltage and ultra-high voltage IGBT product platforms, and contribute to the localization of high-end discrete devices. "China's IC industry is developing rapidly, and it is expected to account for 30% of the world's IC market by 2013. The huge Chinese market has brought great opportunities for local manufacturing industry." said Chen Wei, president of Asia Pacific and Japan, Shanghai Grace Semiconductor Manufacturing Co., Ltd. , "Grace Semiconductor began its formal operation in 2003. After several years of development, the purification plant has 24,000 square meters, and the technical capacity for mass production covers 0.25/0.18/0.15/0.14/0.13/0.12μm and PowerMOS. .

China's domestic design should go hand in hand with the design industry as the source of IC industry development and the driving force for the development of the entire industry. The vigorous development of the IC design industry benefited from technological innovation. Thanks to the expansion of IC applications, it also benefited from the warming up of domestic and foreign markets. Although IC design is originally a relatively weak link in China's IC industry, it has accounted for more than 20% of China's IC output value in recent years. Even under the adverse circumstances of the international financial crisis, shrinking markets, and tightening monetary conditions, China's IC manufacturing and packaging industry fell significantly, the design industry still maintained a growth of more than 10%, thriving. The situation this year was more optimistic, with a year-on-year increase of 44.59%.

"Although China has become a major chip consumer in the world, the chips still rely heavily on imports. But China's semiconductor industry is catching up. Many technologies are catching up with the world's leading level." Dr. CEONaveedSherwani, chairman of Open-Silicon, said, "For China In the future, many device designs should be localized as much as possible not only to catch up with the leader in manufacturing technology, but also to increase input in design technology, IP development and protection."

In addition, Marvell Vice President of Global Manufacturing Operations Chen Ruowen and Chairman and President of Verisilicon Dai Weimin also introduced in the emergence of emerging applications, IC design, especially Chinese local IC design how to proceed. They focused on their respective level of technological development and technology platform, elaborated on the current status of China's IC design industry, future development challenges and how to work more closely with manufacturing.

The one-day seminar was attended by more than 200 participants. The seminar will provide a good platform for IC manufacturing, design, application-related experts, engineers, technicians, researchers, and scholars, and will discuss the latest technologies, ideas, and solutions.