Model 3, as Tesla's first model for the public, has been recognized by the market for its high cost performance since its release, and has always been in short supply. The most important reason for this situation is that Tesla’s production capacity is seriously insufficient.
Tesla Model 3
On April 17, Tesla said on Monday that it would close the Model 3 assembly line in Fremont, California, for four to five days to solve the production bottleneck that led to its many postponements of production targets. According to the statement, this plan is similar to the suspension of a production line in February of this year and will not affect the production of Model S and Model X.
"Our Model 3 production plan includes periodic maintenance shutdowns at Fremont and the Super Factory," said a spokesperson for Tesla. "These plans are all designed to increase automation and systematically address bottlenecks so as to speed up production." Nothing unusual, but it is common to see ramp-ups like this.â€
Tesla Automation Factory
In the recent fiscal quarterly report of 2018 published by Tesla, we know that the current production capacity of the Tesla Volkswagen Model 3 has exceeded 2,000 units, but there are still 2,500 vehicles produced by Tesla CEO Musk. Not a small gap. It is understood that Tesla plans to achieve the goal of producing 3,000 units of the Model 3 week at the end of the second quarter of this year. So it seems that this time shutting down the production line may be preparing for this.
Tesla founder Musk
It is worth mentioning that not long ago, Musk said in an interview with the media that because of the problem of the Model 3 capacity, he has once again slept on the floor of the factory. "It's not because it's fun to sleep there. It's too bad," said Musk. However, Musk subsequently said that he does not think that these difficulties should all allow employees to experience, and the boss himself went on holiday.
PGA Sockets Pin Grid Array Socket
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.
PGA Sockets & Adapters Overview
Durable construction for virtually any application
Wide variety of materials, lengths, and sizes
Cost-effective method for replacing, repairing, or upgrading PGA devices
Unique options such as solder preform terminals eliminate the need for wave soldering in mixed SMT/Thru-hole applications
RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating
Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.
Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.
mPGA/PGA (ZIF)These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.
Pin Grid Array (PGA) Sockets Type
mPGA
PGA
Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.
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